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ISSN:
2315-4462 (Print); 2373-3594 (Online)
Abbreviated Title:
Int. J Smart Grid Clean Energy
Frequency:
4 issues per year
Editor-in-Chief:
Prof. Danny Sutanto
DOI:
10.12720/sgce
APC:
500 USD
Indexed by:
Inspec (IET),
CNKI
, Crossref, Google Scholar,
etc
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Editor-in-Chief
Prof. Danny Sutanto
University of Wollongong, Australia
I am very excited to serve as the first Editor-in-Chief of the Journal of Smart Grid and Clean Energy (IJSGCE)and hope that the publication can enrich the readers’ experience .... [
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What's New
2024-03-28
March 28th, 2024 News! Vol. 13, No. 1 has been published online!
2024-01-04
IJSGCE will adopt Article-by-Article Work Flow. For the quarterly journal, each issue will be released at the end of the issue month.
2023-10-09
October 9th, 2023 News! Vol. 11, No. 4 has been published online!
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2016
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Vol. 5, No. 2, April 2016
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Very short-term load forecasting based on a pattern ratio in an office building
Author(s):Ah-Yun Yoon, Hyeon-Jin Moon, Seung-Il Moon
Department of Electrical and Computer Engineering, Seoul National Univ. #013, 1 Gwanangno, Gwanak-gu, Seoul, 08826, South Korea
International Journal of Smart Grid and Clean Energy
, vol. 5, no. 2, April 2016: pp. 94-99
ISSN: 2315-4462 (Print)
ISSN: 2373-3594 (Online)
Digital Object Identifier: 10.12720/sgce.5.2.94-99
Abstract
:The pattern of electric demand needs to be analyzed to obtain a simple and precise Very Short-Term Load Forecast (VSTLF) for an office building because the electric demand of a small power system such as a building is difficult to express as a function. In order to develop an improved VSTLF, data from LG Electronics was analyzed. The proposed method is compared to the conventional method using a correlation between electric demand and temperature. The test results show that the proposed method based on a pattern ratio is better than the conventional method based on linear regression. MAPE of the proposed method is 9.0973%, while MAPE of the conventional method is 9.4533%.
Keywords
:Very short-term load forecasting, office building, pattern, temperature
Full Paper.pdf
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